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Temperature Sensor and Control Technology --Application of NTC Temperature Sensor in Notebook Computer

As computer performance continues to evolve, more and more features are integrated into the computer. As a result, the amount of processing of computers is increasing, and these materials contain multimedia data and 3D animation data. In order to meet a large number of data processing needs, more and more chipsets are put into the host, and the operating frequency of the CPU and chipset is also increasing. More chipsets and faster clock frequencies mean more heat is generated.
NTC temperature sensor in notebook applications

For notebook computers, users require not only better performance of the system, but also light, thin and small in appearance, which is another challenge faced by designers. In the limited space, how to dissipate the heat generated by the system is a difficult problem. How to balance system performance, system comfort (including the temperature of the laptop case, the noise generated by the fan rotation), and system runtime. It is an important topic in notebook computer design.

Components in a laptop that need to monitor temperature The CPU is the largest source of heat in the system. At present, the Intel Dothan processor commonly used in notebook computers has an instantaneous maximum power consumption of about 37W. The AMD ATHLON processor has an instantaneous maximum power consumption of approximately 35W to 40W. The instantaneous maximum power consumption of Intel's next-generation Merom processor will be as high as 50W. The CPU is an important target for temperature detection in computers. Currently, whether it is an Intel or AMD CPU, the CPU contains a diode for remote temperature detection. To provide a temperature sensor, directly detect the temperature of the CPU's internal die and perform precise temperature control.

A processing chip (GPU) is another important source of heat in the system in addition to the CPU. Due to the increased resolution of the liquid crystal display, the data processing capacity of the graphics processing chip is also greatly increased. In order to make the graphics processing chip work reliably, the currently widely used graphics processing chip, like the CPU, includes a diode that provides remote temperature detection. In order to directly detect the temperature of the inner die of the graphics processing chip and control its temperature. In notebooks, other components that may require temperature detection and control include DDR memory, hard drives, and optical drives. The purpose of temperature sensing is to enable the laptop's embedded microcontroller to properly manage and manage the power of the notebook.

Laptop remote temperature sensing diode

Accurate and reliable temperature sensing has the following advantages in notebook applications:
1. Accurate temperature detection allows the system to perform at its highest efficiency:
When the actual temperature of the component does not reach the critical point of system down-conversion. Because the temperature sensor detects errors, it may cause the system to reduce the frequency of the action early, which will make the system unable to achieve maximum performance.

2. Accurate temperature detection reduces system noise and extends computer battery life: If the temperature detected by the temperature sensor is higher than the actual temperature of the system, it will cause the fan to run early. Or the fan speed is higher than the actual demand, which will cause unnecessary fan noise and power consumption of the system.

3. Accurate temperature detection can improve system stability and increase product competitiveness: If the temperature sensor detection temperature is lower than the actual temperature of the system, the system may still maintain a higher frequency when the actual temperature of the system has reached the critical point of frequency reduction. Consequently, the system is paralyzed or even damaged. In addition, accurate temperature sensing allows the system to use the smallest thermal module, which reduces the cost of the thermal module and increases product competitiveness.
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